Tag

#CoWoS

Articles tagged CoWoS.

Nvidia Is Prepaying Amkor $1.5B to Build US Chip Packaging. Packaging Is the Bottleneck.
Hardware & Devices

Nvidia Is Prepaying Amkor $1.5B to Build US Chip Packaging. Packaging Is the Bottleneck.

Nvidia and Amkor struck a $1.5 billion partnership, with Nvidia prepaying to expand Amkor's advanced-packaging capacity in Arizona. Packaging is the constraint on how many AI accelerators ship, ahead of raw chip supply.

Maya Iverson
TSMC Grew 36% and Its Packaging Lines Are Sold Out. That Is the AI Ceiling.
Hardware & Devices

TSMC Grew 36% and Its Packaging Lines Are Sold Out. That Is the AI Ceiling.

TSMC reported Q2 revenue of about $39.6 billion, up 36% on AI demand. N3 and CoWoS packaging are sold out through year-end, which sets the ceiling on how many AI chips ship in 2026.

Maya Iverson